US Patent Issued to Intel on Dec. 23 for "Package architecture of scalable compute wall having compute bricks with vertically stacked dies" (Oregon, Arizona, California Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,128, issued on Dec. 23, was assigned to Intel Corp. (Santa Clara, Calif.).

"Package architecture of scalable compute wall having compute bricks with vertically stacked dies" was invented by Sagar Suthram (Portland, Ore.), Debendra Mallik (Chandler, Ariz.), Wilfred Gomes (Portland, Ore.), Pushkar Sharad Ranade (San Jose, Calif.), Nitin A. Deshpande (Chandler, Ariz.), Omkar G. Karhade (Chandler, Ariz.), Ravindranath Vithal Mahajan (Chandler, Ariz.) and Abhishek A. Sharma (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of a microelectronic assembly comprise: a plurality of microelectronic sub-assemblies arranged in a coplana...