US Patent Issued to Intel on Dec. 23 for "On-package die-to-die (D2D) interconnect for memory using universal chiplet interconnect express (UCIe) PHY" (American, Indian Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,505,065, issued on Dec. 23, was assigned to Intel Corp. (Santa Clara, Calif.).

"On-package die-to-die (D2D) interconnect for memory using universal chiplet interconnect express (UCIe) PHY" was invented by Debendra Das Sharma (Saratoga, Calif.), Narasimha Lanka (Dublin, Calif.), Peter Onufryk (Flanders, N.J.), Swadesh Choudhary (Mountain View, Calif.), Gerald Pasdast (San Jose, Calif.), Zuoguo Wu (San Jose, Calif.), Dimitrios Ziakas (Portland, Ore.) and Sridhar Muthrasanallur (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein may include apparatus, systems, techniques, or processes that are directed to on-packag...