US Patent Issued to Intel on Dec. 23 for "HBI die architecture with fiducial in street for no metal depopulation in active die" (Arizona Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,085, issued on Dec. 23, was assigned to Intel Corp. (Santa Clara, Calif.).

"HBI die architecture with fiducial in street for no metal depopulation in active die" was invented by Omkar Karhade (Chandler, Ariz.) and Nitin A. Deshpande (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include semiconductor devices. In one embodiment, a die comprises a substrate, where the substrate comprises a semiconductor material. In an embodiment, a backend layer is over the substrate, where the backend layer comprises conductive routing. In an embodiment, the die further comprises a protrusion extending out from an edge o...