US Patent Issued to Intel on Dec. 2 for "Heating element and supporting circuitry for adapting a nominally rated semiconductor chip to an extremely cold environment" (Oregon, California Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,026, issued on Dec. 2, was assigned to Intel Corp. (Santa Clara, Calif.).

"Heating element and supporting circuitry for adapting a nominally rated semiconductor chip to an extremely cold environment" was invented by Aslam Haswarey (Portland, Ore.), Kevin Wells (Folsom, Calif.), Mehran Adyani-Yazdi (Hillsboro, Ore.), Daniel R. Russell (Hillsboro, Ore.), James C. Mowery (Beaverton, Ore.), Vinesh Lal (Beaverton, Ore.) and Xiangying Ma (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal control circuit is described. The thermal control circuit includes a heating element disposed within an electronic circuit board having a semiconduct...