ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,032, issued on Dec. 2, was assigned to Intel Corp. (Santa Clara, Calif.).
"Cooling of conformal power delivery structures" was invented by Feras Eid (Chandler, Ariz.), Aleksandar Aleksov (Chandler, Ariz.), Henning Braunisch (Phoenix), Adel Elsherbini (Chandler, Ariz.), Thomas L. Sounart (Chandler, Ariz.) and Johanna Swan (Scottsdale, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Technologies for cooling conformal power delivery structures are disclosed. In one embodiment, an integrated circuit component has a die with a backside power plane mated to it. A lid of the integrated circuit component is mated with the backside power plane, forming a...