US Patent Issued to Intel on Dec. 16 for "Packaging architecture with intermediate routing layers" (Oregon, Arizona Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,207, issued on Dec. 16, was assigned to Intel Corp. (Santa Clara, Calif.).

"Packaging architecture with intermediate routing layers" was invented by Kimin Jun (Portland, Ore.), Adel A. Elsherbini (Tempe, Ariz.), Christopher M. Pelto (Beaverton, Ore.), Georgios Dogiamis (Chandler, Ariz.), Bradley A. Jackson (Lake Oswego, Ore.), Shawna M. Liff (Scottsdale, Ariz.) and Johanna M. Swan (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure provide a microelectronic assembly comprising: a first plurality of integrated circuit (IC) dies in a first layer; a second plurality of IC dies in a second layer; and a...