ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,111, issued on Dec. 16, was assigned to Intel Corp. (Santa Clara, Calif.).
"Heat-assisted die ejection system" was invented by Chetan Harsha Edara (Chandler, Ariz.) and Kyle Pfeiffer (Beaverton, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to die ejection system including a heated element configured to heat an adhesive layer on a bottom side of the adhesive layer, wherein a die is placed on the top side of the adhesive layer, and the die is removed from the adhesive layer by heat-assisted means. A conventional needle-based die ejector system may also be converted into the present die ejection system using a ...