US Patent Issued to Intel on Dec. 16 for "Electronic package with passive component between substrates" (Malaysian Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,155, issued on Dec. 16, was assigned to Intel Corp. (Santa Clara, Calif.).

"Electronic package with passive component between substrates" was invented by Eng Huat Goh (Penang, Malaysia), Min Suet Lim (Simpang Ampat, Malaysia), Jiun Hann Sir (Gelugor, Malaysia), Hoay Tien Teoh (Paya Terubong, Malaysia) and Jimmy Huat Since Huang (Georgetown, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package with passive components located between a first substrate and a second substrate. The electronic package can include a first substrate including a device interface for communication with an electronic device. An interposer can be electr...