ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,499,074, issued on Dec. 16, was assigned to Intel Corp. (Santa Clara, Calif.).
"Die-to-die interconnect protocol layer" was invented by Debendra Das Sharma (Saratoga, Calif.), Swadesh Choudhary (Mountain View, Calif.), Narasimha Lanka (Dublin, Calif.), Lakshmipriya Seshan (Sunnyvale, Calif.), Gerald Pasdast (San Jose, Calif.) and Zuoguo Wu (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Protocol layer logic in a protocol stack receives an indication that a particular mode is to be utilized on a die-to-die (D2D) link connecting a first device to a second device. The protocol layer logic generates data to be sent on the D2D link to adapt ...