US Patent Issued to Intel on Aug. 25 for "Die-to-die adapter" (California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,717,747, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Die-to-die adapter" was invented by Swadesh Choudhary (Mountain View, Calif.), Debendra Das Sharma (Saratoga, Calif.), Narasimha Lanka (Dublin, Calif.), Lakshmipriya Seshan (Sunnyvale, Calif.), Gerald Pasdast (San Jose, Calif.) and Zuoguo Wu (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die-to-die (D2D) adapter couples to a protocol layer block using a first interface to couple to a protocol layer block and couples to a physical layer (PHY) block using a second interface. The D2D adapter is to determine parameters of a D2D link to couple a first die to a...