US Patent Issued to Intel on Aug. 25 for "Connector to electrically couple multiple substrates" (Malaysian Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,719,185, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Connector to electrically couple multiple substrates" was invented by Jiun Hann Sir (Gelugor, Malaysia), Eng Huat Goh (Ayer Itam, Malaysia), Poh Boon Khoo (Perai, Malaysia), Chin Mian Choong (Georgetown, Malaysia), Jooi Wah Wong (Bukit Mertajam, Malaysia) and Jia Yun Wong (Pulau, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments herein relate to systems, apparatuses, or processes for a connector for a modular memory package that includes one or more memory dies on a substrate, where the connector directly electrically couples electrical contacts at an edge ...