US Patent Issued to Intel on Aug. 18 for "EMI cage for microstrip routing via dual layer underfill concept" (Malaysian, American, Indian Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,928, issued on Aug. 18, was assigned to Intel Corp. (Santa Clara, Calif.).

"EMI cage for microstrip routing via dual layer underfill concept" was invented by Eng Huat Goh (Ayer Itam, Malaysia), Jiun Hann Sir (Gelugor, Malaysia), Chee Kheong Yoon (Bayan Lepas, Malaysia), Telesphor Kamgaing (Chandler, Ariz.), Min Suet Lim (Gelugor, Malaysia), Kavitha Nagarajan (Bangalore, India) and Chu Aun Lim (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, a stif...