ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,566, issued on Aug. 11, was assigned to Intel Corp. (Santa Clara, Calif.).
"Stackable memory module with double-sided compression contact pads" was invented by Xiang Li (Portland, Ore.), Konika Ganguly (Portland, Ore.), George Vergis (Portland, Ore.), Stephen Christianson (Tigard, Ore.) and Xiaopeng Dong (Portland, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An example of an apparatus may comprise a first set of compression contact pads formed on a first side of a circuit board, a second set of compression contact pads formed on a second side of the circuit board opposite to the first side of the circuit board, where the first set of compres...