US Patent Issued to Intel on April 7 for "Passive circuit on a back-end-of-line of a package" (California, Oregon, Texas, Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,996, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.).

"Passive circuit on a back-end-of-line of a package" was invented by Qiang Yu (Saratoga, Calif.), Georgios C. Dogiamis (Chandler, Ariz.), Gwang-Soo Kim (Portland, Ore.), Ibukunoluwa Momson (Allen, Texas), Ali Farid (Sunnyvale, Calif.) and Said Rami (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments herein relate to systems, apparatuses, or processes directed to fabricating passive circuits on a surface of a BEOL of a package, for example on a C4 connection layer of the BEOL. In embodiments, the passive circuits may be fabricated using a standard bump p...