US Patent Issued to Intel on April 7 for "Package structures with patterned die backside layer" (Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,989, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.).

"Package structures with patterned die backside layer" was invented by Pilin Liu (Chandler, Ariz.), Feras Eid (Chandler, Ariz.), Michael Baker (Gilbert, Ariz.), Wenhao Li (Chandler, Ariz.) and Zhaozhi Li (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic die package structures formed according to some embodiments may include a substrate and a die having a first side and a second side. The first side of the die is coupled to the substrate, and a die backside layer is on the second side of the die. The die backside layer includes a plurality of unfi...