US Patent Issued to INSPUR ELECTRONIC INFORMATION INDUSTRY on Feb. 17 for "Creating thick-provisioned volume according to a quality of service policy based on the workload of a cluster" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,554,437, issued on Feb. 17, was assigned to INSPUR ELECTRONIC INFORMATION INDUSTRY Co. LTD. (Jinan, China).

"Creating thick-provisioned volume according to a quality of service policy based on the workload of a cluster" was invented by Ze Peng (Jinan, China) and Duan Zhang (Jinan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method, an apparatus, a device, and a medium for creating a thick-provisioned volume. The method includes: creating a thin volume; acquiring a current workload of a cluster; determining a volume filling thread quantity corresponding to the thin volume and a Quality of Service (QOS) policy based on the workload and a preset...