ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,686, issued on June 3, was assigned to Innolux Corp. (Miao-Li County, Taiwan).
"Redistribution layer structure" was invented by Hung-Sheng Chou (Miao-Li County, Taiwan), Wen-Hsiang Liao (Miao-Li County, Taiwan), Kuo-Jung Fan (Miao-Li County, Taiwan), Heng-Shen Yeh (Miao-Li County, Taiwan) and Cheng-Chi Wang (Miao-Li County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A redistribution layer structure is provided. The redistribution layer structure includes a first metal layer, a first dielectric layer disposed on the first metal layer, a second metal layer disposed on the first dielectric layer, and a second dielectric layer disposed on the ...