ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,252, issued on July 15, was assigned to Innolux Corp. (Miaoli County, Taiwan).
"Method for manufacturing composite layer circuit structure of electronic device" was invented by Yu-Jen Chang (Miao-Li County, Taiwan), Ching-Wei Chen (Miao-Li County, Taiwan), Tzu-Yen Chiu (Miao-Li County, Taiwan), Hung-I Tseng (Miao-Li County, Taiwan) and Chun-Chin Fan (Miao-Li County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a composite layer circuit structure of an electronic device is provided. First, a first conductive layer is formed on a carrier plate. Next, a first photoresist layer is formed on the first conductive layer....