ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,265, issued on Feb. 10, was assigned to INNODISK Corp. (New Taipei, Taiwan).
"High capacitance module" was invented by Chih-Chieh Kao (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A high capacitance module for electrically connecting to a second circuit board comprises a first circuit board provided with a plurality of metal contacts and at least one capacitor core arranged on the first circuit board. The capacitor cores have connection pins that are electrically connected to the metal contacts through conductive glue. An adhesive layer covers the capacitor cores. The capacitor cores are electrically connected to a memory module...