ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,797, issued on Sept. 9, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Hybrid embedded package" was invented by Stefan Woetzel (Erfurt, Germany) and Chee Yang Ng (Muar, Malaysia).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of producing a semiconductor package includes providing a substrate formed of electrically insulating material and including a die mounting surface, and a first semiconductor die embedded within the substrate, the first semiconductor die including a first conductive terminal that faces the die mounting surface, providing a second semiconductor die that includes a first conductive terminal, and mounting...