US Patent Issued to Infineon Technologies on Oct. 20 for "Semiconductor module and method for fabricating a semiconductor module" (Austrian, German Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,373, issued on Oct. 20, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor module and method for fabricating a semiconductor module" was invented by Ramdas Rangnath Ugale (Villach, Austria) and Daniel SchleiBer (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes: a printed circuit board having a first side and an opposite second side; a plurality of power semiconductor packages arranged over and electrically coupled to the first side of the printed circuit board, a first side of the power semiconductor packages facing the first side of the printed circuit board and an opposite second side...