US Patent Issued to Infineon Technologies on June 30 for "Semiconductor circuit arrangement and method for a semiconductor circuit arrangement" (Austrian Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,390, issued on June 30, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor circuit arrangement and method for a semiconductor circuit arrangement" was invented by Udo Ausserlechner (Villach, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor circuit arrangement includes a substrate, at least two first stress-sensitive elements in a first region of the substrate and at least two second stress-sensitive elements in a second region of the substrate. The first stress-sensitive elements each have an electrical characteristic which is dependent on a first component and a second component of a mechanical stres...