US Patent Issued to Infineon Technologies on Feb. 3 for "Fabrication of electroplated nickel-iron layers with titanium-copper seed layer" (German Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,509, issued on Feb. 3, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Fabrication of electroplated nickel-iron layers with titanium-copper seed layer" was invented by Michael Kirsch (Regensburg, Germany), Patrick Hanekamp (Laaber, Germany), Werner Robl (Regensburg, Germany), Klemens Prugl (Regensburg, Germany), Juergen Zimmer (Neubiberg, Germany) and Christoph Oswald (Riemerling, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A layered structure includes a silicon-based substrate comprising a substrate surface; a titanium-copper seed layer arranged on the substrate surface, wherein the titanium-copper seed layer comprises a t...