US Patent Issued to Infineon Technologies on Aug. 18 for "Method for processing a semiconductor wafer and semiconductor composite structure" (Austrian, German Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,926, issued on Aug. 18, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Method for processing a semiconductor wafer and semiconductor composite structure" was invented by Francisco Javier Santos Rodriguez (Villach, Austria), Alexander Breymesser (Villach, Austria), Erich Griebl (Dorfen, Germany), Michael Knabl (Finkenstein, Austria), Matthias Kuenle (Villach, Austria), Andreas Moser (Maria-Rain, Austria), Roland Rupp (Lauf, Germany), Hans-Joachim Schulze (Taufkirchen, Germany), Sokratis Sgouridis (Annenheim, Austria) and Stephan Voss (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for processing a semiconductor wafer ...