ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,237, issued on Sept. 8, was assigned to Infineon Technologies Austria AG (Villach, Austria).
"Semiconductor device and method" was invented by Thomas Ralf Siemieniec (Villach, Austria) and Oliver Blank (Villach, Austria).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a semiconductor substrate having a first major surface; a trench extending from the first major surface into the semiconductor substrate and having a base and a side wall extending from the base to the first major surface; a field plate arranged in the trench and having a height f; and a dielectric structure arranged between the semiconductor body and the...