US Patent Issued to Infineon Technologies Austria on Sept. 29 for "Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices" (Singaporean, German Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,297, issued on Sept. 29, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices" was invented by Stefan Schwab (Singapore) and Julian Treu (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device comprises a leadframe comprising a die pad and a plurality of leads, a semiconductor die disposed on the die pad, the semiconductor die including a contact pad on a first main face thereof, and one or more bond wires connected with the contact pad, wherein a lead of the plurality of leads is bent back...