US Patent Issued to Infineon Technologies Austria on March 17 for "Method of forming an interconnection between an electric component and an electronic component" (German Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,981, issued on March 17, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Method of forming an interconnection between an electric component and an electronic component" was invented by Alexander Heinrich (Bad Abbach, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming an interconnection includes: providing an electronic component having a first main face and a first metallic layer disposed on the first main face; providing an electric component having a second main face and a second metallic layer disposed on the second main face, at least one of the first or second metallic layers including an oxide lay...