US Patent Issued to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE on March 31 for "Power semiconductor module" (Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. D1,120,892, issued on March 31, was assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu, Taiwan).

"Power semiconductor module" was invented by Yuan-Cheng Huang (New Taipei City, Taiwan), I-Hung Chiang (Yuanlin City, Taiwan), Ji-Yuan Syu (Kaohsiung City, Taiwan), Hsin-Han Lin (Zhudong Township, Taiwan), Po-Kai Chiu (Taoyuan City, Taiwan) and Kuo-Shu Kao (Zhubei City, Taiwan).

The patent was filed on Dec. 22, 2022, under Application No. D/863,826.

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