US Patent Issued to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE on Feb. 17 for "Electronic device having substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,672, issued on Feb. 17, was assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu, Taiwan).

"Electronic device having substrate" was invented by Tsung-Yi Hung (Zhubei, Taiwan) and Shih-Hsien Wu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a substrate, an outer layer, a conductive line layer, and a switchable circuit chip. The substrate has a plurality of having a plurality of first vias. The outer layer is disposed on a side of the substrate and has a plurality of second vias. The first vias have a larger distribution density or quantity than the second vias, so that a part of the first vias a...