US Patent Issued to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE on Dec. 16 for "Embedded packaging structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,169, issued on Dec. 16, was assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu, Taiwan).

"Embedded packaging structure" was invented by Jing-Yao Chang (New Taipei, Taiwan) and Yu Chih Wang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embedded packaging structure includes a die, a sintered metal layer, an encapsulation layer and a conductive via. The die includes a metallic bonding layer. Sintered metal layer is bonded to the metallic bonding layer. The encapsulation layer covers the die. The conductive via is provided in a blind hole of the encapsulation layer, and the conductive via is electrically connected with the...