ALEXANDRIA, Va., Aug. 26 -- United States Patent no. D1,090,465, issued on Aug. 26, was assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu, Taiwan).
"Power module housing" was invented by Yuan-Cheng Huang (New Taipei, Taiwan), Ji-Yuan Syu (Kaohsiung, Taiwan) and Chun-Kai Liu (Hsinchu, Taiwan).
The patent was filed on April 18, 2024, under Application No. D/938,184.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1090465&OS=D1090465&RS=D1090465
Disclaimer: Curated by HT Syndication....