US Patent Issued to Industrial Technology Research Institute on Aug. 12 for "Three-dimensional circuit board, manufacturing method thereof, and probe card" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,389,535, issued on Aug. 12, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan).

"Three-dimensional circuit board, manufacturing method thereof, and probe card" was invented by Min-Chieh Chou (Taipei, Taiwan), Meng-Chi Huang (Taoyuan, Taiwan), Tune-Hune Kao (Hsinchu, Taiwan) and Yue-Zhen Huang (Yilan County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional circuit board, including a ceramic substrate and multiple circuits, is provided. The ceramic substrate has a first plane, a second plane, a third plane located between the first plane and the second plane, a first side surface connecting the first plane ...