US Patent Issued to Imec vzw on Nov. 3 for "Method for forming an interconnection structure" (Belgian Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,733, issued on Nov. 3, was assigned to Imec vzw (Leuven, Belgium).

"Method for forming an interconnection structure" was invented by Anshul Gupta (Leuven, Belgium), Zsolt Tokei (Leuven, Belgium) and Stefan Decoster (Bertem, Belgium).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming and patterning a first dielectric over a substrate; covering the first dielectric with metal and planarizing the metal exposing a surface of the first dielectric and forming a first metal; forming a second dielectric over the first dielectric and the first metal; covering the second dielectric with metal and planarizing the metal exposing a surface of...