US Patent Issued to IHP GMBH-INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS / LEIBNIZ-INSTITUT FUR INNOVATIVE MIKROELEKTRONIK on April 21 for "Integrated optoelectronic device with optical interconnect structure for improved BEOL device integration" (German Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,609,510, issued on April 21, was assigned to IHP GMBH-INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS / LEIBNIZ-INSTITUT FUR INNOVATIVE MIKROELEKTRONIK (Frankfurt, Germany).

"Integrated optoelectronic device with optical interconnect structure for improved BEOL device integration" was invented by Karsten Voigt (Frankfurt, Germany), Lars Zimmermann (Frankfurt, Germany), Christian Mai (Frankfurt, Germany) and Jochen Kreissl (Frankfurt, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated optoelectronic device comprises a substrate with a silicon layer comprising one or more electronic components. An interconnect stack comprising a plura...