US Patent Issued to ICLEAGUE TECHNOLOGY on April 14 for "Semiconductor structure and method for forming semiconductor structure" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,453, issued on April 14, was assigned to ICLEAGUE TECHNOLOGY Co. LTD. (Jiaxing, China).

"Semiconductor structure and method for forming semiconductor structure" was invented by Wenyu Hua (Jiaxing, China) and Boyong He (Jiaxing, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a method for forming the semiconductor structure are provided. The semiconductor structure includes: a substrate including a first surface and a second surface, which includes a plurality of active areas arranged along a first direction and in parallel along a second direction; a plurality of first recesses arranged in the substrate; a word li...