US Patent Issued to ICEOTOPE GROUP on Jan. 27 for "Heat sink, heat sink arrangement and module for liquid immersion cooling" (British Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,451, issued on Jan. 27, was assigned to ICEOTOPE GROUP Ltd. (South Yorkshire, Great Britain).

"Heat sink, heat sink arrangement and module for liquid immersion cooling" was invented by David Amos (South Yorkshire, Great Britain), Neil Edmunds (South Yorkshire, Great Britain), Andrew Young (South Yorkshire, Great Britain), Jasper Kidger (South Yorkshire, Great Britain) and Nathan Longhurst (South Yorkshire, Great Britain).

According to the abstract* released by the U.S. Patent & Trademark Office: "Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surfa...