ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,510,941, issued on Dec. 30, was assigned to ICEOTOPE GROUP Ltd. (Rotherham, Great Britain).
"Cooling module" was invented by Neil Edmunds (Rotherham, Great Britain) and John Charlesworth (Rotherham, Great Britain).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling module for a printed circuit board having one or more heat generating components. The cooling module comprises a casing defining a first internal volume adapted for mounting a printed circuit board therein, the casing comprising a first internal major surface and a second internal major surface. The cooling module further comprises a chamber defining a second internal volume in fluid comm...