ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,432, issued on April 14, was assigned to Ice Qube Inc. (Greensburg, Pa.).
"Modular enclosures for component cooling" was invented by Ridge Altman (Greensburg, Pa.) and Jared Skoloda (Greensburg, Pa.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment provides an enclosure, including: a frame system comprising one or more frame components forming an internal skeleton; the one or more frame components having a first rigidity; and an external shell comprising one or more shell components that are configured to reversibly attach to the frame system; the one or more shell components having a second rigidity, the second rigidity being lower than...