US Patent Issued to IBIDEN on Sept. 8 for "Printed wiring board manufacturing method and processing system" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,111, issued on Sept. 8, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Printed wiring board manufacturing method and processing system" was invented by Katsuo Kawaguchi (Ogaki, Japan), Tsutomu Yamauchi (Ogaki, Japan), Takeshi Takagi (Ogaki, Japan), Takuya Otsuki (Ogaki, Japan) and Masanori Sano (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a printed wiring board includes preparing an intermediate substrate including an insulating layer, a conductor layer including circuits, and a first resin insulating layer, inputting, to a laser processing machine that forms openings, positions of the openings, generatin...