US Patent Issued to IBIDEN on Oct. 27 for "Printed wiring board" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,583, issued on Oct. 27, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Printed wiring board" was invented by Atsushi Ishida (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes a first conductor layer, a resin insulating layer laminated on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The resin insulating layer includes resin and inorganic particles including first particles and second particles su...