US Patent Issued to IBIDEN on May 12 for "Wiring substrate" (Japanese Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,283, issued on May 12, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate" was invented by Toshiki Furutani (Ibi-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a first insulating layer, a conductor layer formed on the first insulating layer and including a wiring pattern, an organic coating film formed on the conductor layer such that the organic coating film is formed on the wiring pattern of the conductor layer, and a second insulating layer formed on the first insulating layer such that the second insulating layer is covering the conductor layer. The conductor layer is formed such that the wiri...