US Patent Issued to IBIDEN on March 3 for "Printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,578, issued on March 3, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Printed wiring board" was invented by Jun Sakai (Ogaki, Japan), Kyohei Yoshikawa (Ogaki, Japan) and Shunya Hatanaka (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and a metal layer on the seed layer, a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer, and a bas...