ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,664, issued on Feb. 24, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Wiring substrate" was invented by Atsushi Deguchi (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a resin insulating layer, and a conductor layer formed on the resin insulating layer and including a seed layer and a metal film formed on the seed layer such that the conductor layer has wiring patterns including wirings. The conductor layer is formed such that each of the wirings in the wiring patterns has undercut parts on side surfaces extending to the resin insulating layer, and the wirings in the conductor layer include outer wirings f...