ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,728,703, issued on Sept. 8, was assigned to HYUNDAI MOTOR COMPANY (Seoul, South Korea) and KIA Corp. (Seoul, South Korea).
"Heat pump system for a vehicle" was invented by Jeawan Kim (Hwaseong-si, South Korea), Hochan An (Hwaseong-si, South Korea), Yeonho Kim (Seoul, South Korea), Hoyoung Jeong (Hwaseong-si, South Korea), Man Hee Park (Suwon-si, South Korea), Yeong Jun Kim (Incheon, South Korea), Jae Yeon Kim (Hwaseong-si, South Korea) and Gwi Taek Kim (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump system for a vehicle may increase the temperature of the coolant by selectively using the heat supplied from air conditi...