ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,746,795, issued on Sept. 29, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea).
"Heat pump system for vehicle" was invented by Seong-Bin Jeong (Hwaseong-si, South Korea), Jae-Eun Jeong (Hwaseong-si, South Korea), Yong Woong Cha (Yongin-si, South Korea) and Wan Je Cho (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment heat pump system for a vehicle includes a valve module for controlling a flow of a coolant according to a selected mode for temperature adjustment of a vehicle interior and temperature adjustment of a battery module, a first line connected to the valve module, an e...