ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,974, issued on Sept. 15, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea).
"Power module" was invented by Se Yoon Jeong (Hwaseong-si, South Korea), Jun Hee Park (Hwaseong-si, South Korea) and Suk Hyun Lim (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module includes a first substrate formed by stacking a plurality of layers in a first axis direction, a semiconductor chip electrically connected to the first substrate, a printed circuit board connected to the semiconductor chip and comprising at least one step portion with a reduced thickness compared to the surrounding area ...