ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,995, issued on March 31, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea).
"Power module" was invented by Tae Hwa Kim (Hwaseong-Si, South Korea), Jin Myeong Yang (Seongnam-Si, South Korea) and Je Hwan Lee (Seongnam-Si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module includes a first substrate and a second substrate; a semiconductor chip; a resistor electrically connecting the first substrate and the second substrate while being spaced from the semiconductor chip in the horizontal direction, the resistor including a resistance value greater than a resistance value of the metal layer;...