ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,504, issued on March 24, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea).
"Direct cooling type power module" was invented by Suk Hyun Lim (Hwaseong-si, South Korea) and Tae Hwa Kim (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A direct cooling type power module comprising, an enclosure filled with an insulating fluid, a power semiconductor device disposed inside the enclosure and a bonding unit comprising a porous layer, and a thermally conductive layer to which the power semiconductor device is bonded, and allowing the power semiconductor device to exchange heat with the insulati...