US Patent Issued to Hyundai Motor, Kia on Feb. 24 for "Method and apparatus for predicting temperature of heat sink, and method for measuring junction temperature of power module using thereof" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,560,494, issued on Feb. 24, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea).

"Method and apparatus for predicting temperature of heat sink, and method for measuring junction temperature of power module using thereof" was invented by Yeongju Koh (Suncheon-Si, South Korea), Seong Min Lee (Seoul, South Korea), Sangcheol Shin (Suwon-Si, South Korea) and JeHwan Lee (Seongnam-Si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for predicting a temperature of a heat sink for cooling a power module including at least one switching element and a Negative Temperature Coefficient of Resistance (NTC) sen...