ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,965, issued on Aug. 26, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea).
"Power module" was invented by Han Jin Do (Incheon, South Korea), Jin Myeong Yang (Seongnam-si, South Korea) and Sung Won Park (Icheon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module includes an upper substrate, a lower substrate, a first semiconductor chip, a first spacer configured to electrically connect a first metal layer to a second metal layer, a second spacer configured to electrically connect the first semiconductor chip to the first metal layer, a first connection layer having conductivity, disposed ...